Hon. William C. Conner Writing Competition

Award Amount
Award Amount

$2,500

Application deadline
Application deadline

February 28

Awarded By:

New York Intellectual Property Law Association (NYIPLA)

Number of Awards & Eligibility: Two awards will be provided annually.
In order to qualify, students must meet the following criteria:
  1. Must be currently enrolled in a law school in the United States.

In order to qualify, students must meet the following criteria:

Description: The Hon. William C. Conner Writing Competition is available for current law school students in the United States. Applicants must submit a legal paper on the topic of intellectual property.

Application requirements for the Hon. William C. Conner Writing Competition are:

  • Application form
  • Essay
Additional Information: The Hon. William C. Conner Writing Competition is provided annually by the New York Intellectual Property Law Association (NYIPLA) and awards multiple scholarships to current law school students who submit excellent papers on the topic of intellectual property. Papers will be judged based on professionalism, topic relevance, organization, quality of legal analysis, and overall strength of writing.

Award Amount: $1,500 for the first place applicant and $1,000 for the runner-up. Awards are provided on a one-time basis and are non-renewable.  The total dollars awarded for this scholarship is $2,500.

Deadline Information:

Deadline for this scholarship is Sunday, February 28

Deadline Information:

Deadline for this scholarship is Sunday, February 28

Application instructions for the Hon. William C. Conner Writing Competition are available online using the provided links. To be considered for this scholarship, students must submit an original legal paper of up to 20 pages in length that addresses one or more of the traditional subject areas of intellectual property law, such as patents, trademarks, copyrights, trade secrets, unfair trade practices, and antitrust law. All written submissions must be received no later than the deadline date.
About New York Intellectual Property Law Association (NYIPLA):
Contact Information: Richard H. Brown, -
Address: Day Pitney LLP 7 Times Square New York, New York 10036-7311
Email: rbrown@daypitney.com
Apply Now

Save time. Let us search for you.

Narrow down over 1,000,000 scholarships with personalized results.

Get matched to scholarships that are perfect for you!

Start Your Search

You May Also Like

Privacy Policy   |    Terms of Use   |    FAQs   |    About Us   |    Disclosure: “What Determines Top/Best?”    |    Do Not Sell My Personal Information (CA and NV residents)

Disclosure: EducationDynamics receive compensation for the featured schools on our websites (see “Sponsored Schools” or “Sponsored Listings” or “Sponsored Results”). So what does this mean for you? Compensation may impact where the Sponsored Schools appear on our websites, including whether they appear as a match through our education matching services tool, the order in which they appear in a listing, and/or their ranking. Our websites do not provide, nor are they intended to provide, a comprehensive list of all schools (a) in the United States (b) located in a specific geographic area or (c) that offer a particular program of study. By providing information or agreeing to be contacted by a Sponsored School, you are in no way obligated to apply to or enroll with the school.

The sources for school statistics and data is the U.S. Department of Education's National Center for Education Statistics and the Integrated Postsecondary Education Data System.

This is an offer for educational opportunities that may lead to employment and not an offer for nor a guarantee of employment. Students should consult with a representative from the school they select to learn more about career opportunities in that field. Program outcomes vary according to each institution’s specific program curriculum. Financial aid may be available to those who qualify. The information on this site is for informational and research purposes only and is not an assurance of financial aid.

×

Sponsored Meaning Explained